Large-Area Welding of Dissimilar Metal Materials

for the purpose of cost saving and increasing the target strength, most sputtering targets need to be bonded with alloy backing plates when used. Thus, the bonding between two different metals (alloys) becomes one of the key technical problems in target manufacturing, which requires high bonding ratio (≥ 99%) in order to ensure good performance of heat transfer and enough mechanical bonding strength.

KFMI has the equipment and technologies for DB (Diffusion Bonding), EB (electron beam welding), SB (Solder Bonding) and other welding methods for target bonding. The bonding ratio and welding strength reaches the international advanced level. KFMI is also equipped with large ultrasonic flaw detector (C-Scan) for bonding ratio inspection.